SP2000-0.015-AC-102
Артикул:
SP2000-0.015-AC-102
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Описание
Thermal SIL PAD® Materials
Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean grease-free and flexible.
Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The SIL PAD® materials are made of conformable fiberglass and silicone rubber which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean grease-free and flexible.
Спецификации
Производитель
|
Bergquist Company |
Производитель
|
Bergquist Company |
Серия
|
A2000 / TSP A3000 |
Категория продукта
|
Bergquist Company |
Торговая марка
|
Bergquist Company |
Коммерческое обозначение
|
Sil-Pad |
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